YTM32B1MD14G0MLLT
- Parameters
- Features
- Description
| Part number | YTM32B1MD14G0MLLT |
|---|---|
| Core | M33 |
| Main Frequency | 120MHz |
| PFLASH | 512KB |
| DFLASH | |
| RAM(kB) | 64KB |
| Boot ROM | |
| ECC | Flash + RAM |
| FOTA | A/B Swap(HW) |
| Security | AES, TRNG |
| MPU | 1 |
| DMA | 16CH |
| CRC | 1 |
| I/O | 87 |
| CAN-FD | 3 |
| UART/LIN | 3 |
| SPIs | 4 |
| I2Cs | 2 |
| SENTs | 2CH |
| SAI | |
| ETH | |
| QSPI | |
| ADC channel (#) | 32CH |
| ACMP | 8CH |
| PWM channels | 32 |
| WDG | 1 |
| Debug | SWD, JTAG |
| ASIL Level | ASIL-B |
| Supply voltage (V) | 2.97 to 5.5 |
| Operating temperature range(°C) | 125 |
| Package | LQFP-100 |
• AEC-Q100 qualified
• ASIL B compliant
• RoHS compliant
• 32-bit Cortex-M33 with FPU and DSP, up to 120 MHz
• Up to 256 KB * 2 Program Flash
– Support ECC feature
– Support OTA
• Up to 64 KB SRAM
– Support ECC feature
– Two 16 KB • AEC-Q100 qualified
• ASIL B compliant
• RoHS compliant
• 32-bit Cortex-M33 with FPU and DSP, up to 120 MHz
• Up to 256 KB * 2 Program Flash
– Support ECC feature
– Support OTA
• Up to 64 KB SRAM
– Support ECC feature
– Two 16 KB SRAM blocks support data retention in Powerdown mode
• 32 bytes register file which supports data retention in Powerdown mode
• Provide multiple clock sources including:
– 96 MHz Fast Internal RC Oscillator (FIRC)
– 12 MHz Slow Internal RC Oscillator (SIRC)
– 4~40 MHz Fast Crystal Oscillator (FXOSC)
– Up to 120 MHz Phase-Locked Loop (PLL)
• Power Control Unit (PCU) with internal regulators capable of supporting multiple power modes including:
– Active
– Sleep
– Deepsleep
– Standby
– Powerdown
• Support up to 16 WKU pins, RESET_b pin and 4 module interrupts to wake up from Powerdown mode
• 16 DMA channels with up to 52 hardware trigger sources
• Human-machine interface
– Up to 87 general-purpose input/output (GPIO)
– External interrupt
• Analog modules providing precision mixed-signal capabilities, including:
– One 12-bit, 2Msps SAR ADC, up to 32 external channels and 6 internal channels
– On-chip Analog Comparator (ACMP) with 8-bit DAC, up to 8 channels
– Support temperature sensor
• Timers
– One Timer (TMR)
– One 4-channel Periodic Timer (pTMR)
– One Low Power Timer (lpTMR)
– Four 8-channel Enhanced Timer (eTMR)
– One Real Time Clock (RTC)
– One Programmable Trigger Unit (PTU)
• Serial communication interfaces
– Three FlexCAN modules with FD
– Three LINFlexD modules
– Four SPI modules
– Two I2C modules
– One SENT module
• I/O supporting 2.97 ~ 5.5 V supply
• Wide operating voltage ranges (2.97 ~ 5.5 V) with fully functional flash memory program/erase/read operations
• Temperature range:
– Ambient operating temperature: -40 °C ~ 125 °C
– Junction operating temperature: -40 °C ~ 150 °C
• Security and Safety features are supported as follows:
– Cyclic Redundancy Checker (CRC)
– Hardware Cryptography Unit (HCU) which supports AES-128
– True Random Number Generator (TRNG)
– Clock Monitor Unit (CMU)
– Watchdog (WDG)
– External watchdog (EWDG)
– MPU for dynamic task protection (16 regions)
– ECC Management Unit (EMU)
• Debug functionality
– Joint Test Action Group (IEEE 1149.1 standard)
– Serial Wire Debug (SWD)
• Package options
– 100-pin LQFP
– 64-pin LQFPSRAM blocks support data retention in Powerdown mode
• 32 bytes register file which supports data retention in Powerdown mode
• Provide multiple clock sources including:
– 96 MHz Fast Internal RC Oscillator (FIRC)
– 12 MHz Slow Internal RC Oscillator (SIRC)
– 4~40 MHz Fast Crystal Oscillator (FXOSC)
– Up to 120 MHz Phase-Locked Loop (PLL)
• Power Control Unit (PCU) with internal regulators
capable of supporting multiple power modes including:
– Active
– Sleep
– Deepsleep
– Standby
– Powerdown
• Support up to 16 WKU pins, RESET_b pin and 4
module interrupts to wake up from Powerdown mode
• 16 DMA channels with up to 52 hardware trigger sources
• Human-machine interface
– Up to 87 general-purpose input/output (GPIO)
– External interrupt
• Analog modules providing precision mixed-signal capabilities, including:
– One 12-bit, 2Msps SAR ADC, up to 32 external channels and 6 internal channels
– On-chip Analog Comparator (ACMP) with 8-bit DAC, up to 8 channels
– Support temperature sensor
• Timers
– One Timer (TMR)
– One 4-channel Periodic Timer (pTMR)
– One Low Power Timer (lpTMR)
– Four 8-channel Enhanced Timer (eTMR)
– One Real Time Clock (RTC)
– One Programmable Trigger Unit (PTU)
• Serial communication interfaces
– Three FlexCAN modules with FD
– Three LINFlexD modules
– Four SPI modules
– Two I2C modules
– One SENT module
• I/O supporting 2.97 ~ 5.5 V supply
• Wide operating voltage ranges (2.97 ~ 5.5 V) with fully functional flash memory program/erase/read
operations
• Temperature range:
– Ambient operating temperature: -40 °C ~ 125 °C
– Junction operating temperature: -40 °C ~ 150 °C
• Security and Safety features are supported as follows:
– Cyclic Redundancy Checker (CRC)
– Hardware Cryptography Unit (HCU) which supports AES-128
– True Random Number Generator (TRNG)
– Clock Monitor Unit (CMU)
– Watchdog (WDG)
– External watchdog (EWDG)
– MPU for dynamic task protection (16 regions)
– ECC Management Unit (EMU)
• Debug functionality
– Joint Test Action Group (IEEE 1149.1 standard)
– Serial Wire Debug (SWD)
• Package options
– 100-pin LQFP
– 64-pin LQFP
YTM32B1MD1x series provide the highly scalable portfolio of ARM® Cortex®-M33 MCUs in the automotive industry with the Arm Cortex-M33 core at higher frequency, more memory, ASIL-B rating and advanced security module. With 2.97 ~ 5.5 V supply and focus on exceptional EMC/ESD robustness, YTM32B1MD1x series devices are well suited to a wide range of applications in electrical harsh environments, and are optimized for cost-sensitive applications offering low pin-count option.
The YTM32B1MD1x series offer a broad range of memory, peripherals and package options. They share common peripherals and pin counts allowing developers to migrate easily within an MCU family or among the MCU families to take advantage of more memory or feature integration. This scalability allows developers to standardize on the YTM32B1MD1x series for their end product platforms, maximizing hardware and software reuse and reducing time-to-market.
Technical Documentation
| Title | Date |
|---|---|
| Automotive_Solutions_Q1_2026 | 2026-03-06 |
| Silergy_Catalog_Q1_2026 | 2026-02-09 |
| Silergy MCU Selection Guide_YT Family | 2026-06-10 |



